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A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications
Authors
M. Serra, I. Pereiro, A. Yamada, J.-L. Viovy, S. Descroix, D. Ferraro
Abstract
An adhesive-based strategy for the low-cost and reversible sealing of a wide range of materials used in microfluidics, requiring only the application of manually-achievable pressures.
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